IEEE - Institute of Electrical and Electronics Engineers, Inc. - Polymer optical interconnects for PCB

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings

Author(s): H. Schroder ; J. Bauer ; F. Ebling ; W. Scheel
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2001
Conference Location: Potsdam, Germany, Germany
Conference Date: 21 October 2001
Page Count: 7
Page(s): 337 - 343
ISBN (Paper): 0-7803-7220-4
DOI: 10.1109/POLYTR.2001.973306
Regular:

Fraunhofer IZM has developed a packaging concept, which is based on a hybrid carrier, containing both electrical and optical interconnects: the Electrical Optical Circuit Board (EOCB). The key... View More

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