IEEE - Institute of Electrical and Electronics Engineers, Inc. - Fast flip chip assembly for reel-to-reel manufacturing

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings

Author(s): M. Konig ; G. Klink ; M. Feil
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2001
Conference Location: Potsdam, Germany, Germany
Conference Date: 21 October 2001
Page Count: 5
Page(s): 319 - 323
ISBN (Paper): 0-7803-7220-4
DOI: 10.1109/POLYTR.2001.973302
Regular:

For low-cost applications like smart labels, a mounting technology, which allows high throughput is necessary. Therefore, such products are fabricated reel-to-reel on flexible substrates. With... View More

Advertisement