IEEE - Institute of Electrical and Electronics Engineers, Inc. - Smart labels-high volume applications using adhesive flip-chip-technologies

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings

Author(s): F. Kriebel ; T. Seidowski
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2001
Conference Location: Potsdam, Germany, Germany
Conference Date: 21 October 2001
Page Count: 5
Page(s): 304 - 308
ISBN (Paper): 0-7803-7220-4
DOI: 10.1109/POLYTR.2001.973299
Regular:

The authors present requirements, conditions and experiences for the production of smart labels in a reel-to-reel assembly technique. They compare different adhesive flip-chip technologies as well... View More

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