IEEE - Institute of Electrical and Electronics Engineers, Inc. - An improvement of conductive adhesives on high temperature endurance by using Ag-Sn alloy powder

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings

Author(s): M. Yamashita ; K. Suganuma ; M. Komagata ; Y. Shirai
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2001
Conference Location: Potsdam, Germany, Germany
Conference Date: 21 October 2001
Page Count: 5
Page(s): 265 - 269
ISBN (Paper): 0-7803-7220-4
DOI: 10.1109/POLYTR.2001.973292
Regular:

Ag-epoxy isotropic conductive adhesives are expected to be one of the alternatives to solder. One of the fatal drawbacks is, however, the poor compatibility between Ag fillers and Sn plating on... View More

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