IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effects of HDI material for laser via hole forming

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings

Author(s): Y. Mikado
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2001
Conference Location: Potsdam, Germany, Germany
Conference Date: 21 October 2001
Page Count: 5
Page(s): 213 - 217
ISBN (Paper): 0-7803-7220-4
DOI: 10.1109/POLYTR.2001.973283
Regular:

LVH (Laser Via Hole) forming is becoming the main current technology of micro-via forming in the process of build-up PWB. It was effected by the development of laser drilling technology. There are... View More

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