IEEE - Institute of Electrical and Electronics Engineers, Inc. - Evaluation of bismuth as a filler material for anisotropically conductive adhesive

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings

Author(s): M. Vuorela ; J.K. Kivilahti
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2001
Conference Location: Potsdam, Germany, Germany
Conference Date: 21 October 2001
Page Count: 1
ISBN (Paper): 0-7803-7220-4
DOI: 10.1109/POLYTR.2001.973280
Regular:

Summary form only given. Tin and bismuth are metallurgically compatible because they are unable to form intermetallics with each other. When in contact with each other, i.e. in a local chemical... View More

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