IEEE - Institute of Electrical and Electronics Engineers, Inc. - Measurement of residual stresses in flip chip underfill resins

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings

Author(s): Man-Lung Sham ; Jang-Kyo Kim
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2001
Conference Location: Potsdam, Germany, Germany
Conference Date: 21 October 2001
Page Count: 8
Page(s): 160 - 167
ISBN (Paper): 0-7803-7220-4
DOI: 10.1109/POLYTR.2001.973274
Regular:

Flip chip interconnection technology provides a solution to the increasing demands for miniaturisation and weight reduction for applications in portable electronics. The technology enables direct... View More

Advertisement