IEEE - Institute of Electrical and Electronics Engineers, Inc. - Calibrate piezoresistive stress sensors through the assembled structure

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings

Author(s): Ben-Je Lwo ; Ching-Hsing Kao ; Tung-Sheng Chen ; Shen-Yu Wu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2001
Conference Location: Potsdam, Germany, Germany
Conference Date: 21 October 2001
Page Count: 6
Page(s): 149 - 154
ISBN (Paper): 0-7803-7220-4
DOI: 10.1109/POLYTR.2001.973272
Regular:

In this work, a simple assembled structure was designed and fabricated so that the calibration procedures on piezoresisitve stress sensors for microelectronic packaging can be simpler, more... View More

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