IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reliability studies of an isotropic electrically conductive adhesive

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings

Author(s): J.E. Morris ; F. Anderssohn ; S. Kudtarkar ; E. Loos
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2001
Conference Location: Potsdam, Germany, Germany
Conference Date: 21 October 2001
Page Count: 9
Page(s): 61 - 69
ISBN (Paper): 0-7803-7220-4
DOI: 10.1109/POLYTR.2001.973258
Regular:

ICA reliability continues to be a source of concern for widespread practical implementations in commercial products. In addition, there is still much to be understood in the basic principles of... View More

Advertisement