IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reduction of micro-defects in the inter-metal dielectrics (IMD) chemical mechanical polishing (CMP) for ULSI applications

Proceedings of 2001 International Symposium on Electrical Insulating Materials (ISEIM 2001) 2001 Asia Conference on Electrical Insulation Diagnosis (ACEID 2001). 33rd Symposium on Electrical and Electronic Insulating Materials and Applications in Systems

Author(s): Sung-Woo Park ; Sang-Yong Kim ; Yong-Jin Sin
Sponsor(s): IEEJ Tech. Committee on Dielectrics and Electr. Insulation Soc.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2001
Conference Location: Himeji, Japan, Japan
Conference Date: 22 November 2001
Page Count: 4
Page(s): 63 - 66
ISBN (Paper): 4-88686-053-2
DOI: 10.1109/ISEIM.2001.973558

In this work, we studied the relationship between defect generation and pad count to understand the exact efficiency of the slurry filtration, and to find out the appropriate pad usage. Our... View More