IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal fatigue resistance evaluation of solder joints in IGBT power modules for traction applications

Proceedings of the 2000 Power Electronics Specialist Conference

Author(s): Thebaud, J.-M. ; Woirgard, E. ; Zardini, C. ; Sommer, K.-H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Galway, Ireland, Ireland
Conference Date: 23 June 2000
Volume: 3
ISBN (Paper): 0-7803-5692-6
ISSN (Paper): 0275-9306
DOI: 10.1109/PESC.2000.880495
Regular:

Several ageing test campaigns have been carried out to evaluate thermal fatigue resistance of solder alloys used in IGBT power modules. The solder joint between the ceramic substrate and the... View More

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