IEEE - Institute of Electrical and Electronics Engineers, Inc. - Dielectric breakdown study in Polyetherimide films under pressure

Proceedings of the 6th International Conference on Properties and Applications of Dielectric Materials

Author(s): Truong Van Hung ; Hoang The Giam ; Destreul, P. ; Nabila, Z. ; Antoine, A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Xi'an, China
Conference Date: 21 June 2000
Volume: 1
ISBN (Paper): 0-7803-5459-1
DOI: 10.1109/ICPADM.2000.875714
Regular:

Breakdown field F/sub b/ measurements on Polyetherimide (PEI) films were executed under hydrostatic pressures ranging from 1 to 500 bar. Pressures P were obtained by compression of gaseous... View More

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