IEEE - Institute of Electrical and Electronics Engineers, Inc. - The changes of mechanical properties of epoxy/mica insulation materials in aging process

Proceedings of the 6th International Conference on Properties and Applications of Dielectric Materials

Author(s): Yanpeng Hao ; Zhidong Jia ; Xiongwei Jiang ; Naikui Gao ; Hengkun Xie
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Xi'an, China
Conference Date: 21 June 2000
Volume: 1
ISBN (Paper): 0-7803-5459-1
DOI: 10.1109/ICPADM.2000.875661
Regular:

The dynamic mechanical properties of epoxy/mica glass-fiber reinforced composites were studied at different aging stages under electrical-thermal stresses and thermal-mechanical stresses. A new... View More

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