IEEE - Institute of Electrical and Electronics Engineers, Inc. - Dynamic three-dimensional mask-wafer positioning with nanometer exposure overlay accuracy

Digest of Papers Microprocesses and Nanotechnology 2000. 2000 International Microprocesses and Nanotechnology Conference

Author(s): E.E. Moon ; P.N. Everett ; M.W. Meinhold ; H.I. Smith
Sponsor(s): Japan Soc. Appl. Phys.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Tokyo, Japan, Japan
Conference Date: 11 July 2000
Page Count: 2
Page(s): 252 - 253
ISBN (Paper): 4-89114-004-6
DOI: 10.1109/IMNC.2000.872741
Regular:

In previous articles we described an x-ray mask alignment scheme called Interferometric Broad-Band Imaging (IBBI), and an interferometric gapping scheme called Transverse Chirp Gapping (TCG). Both... View More

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