IEEE - Institute of Electrical and Electronics Engineers, Inc. - Formation of sub-100 nm contact hole patterns using a novel resist material

Digest of Papers Microprocesses and Nanotechnology 2000. 2000 International Microprocesses and Nanotechnology Conference

Author(s): Sang-Jun Choi ; Yool Kang ; Jeong-Hee Chung ; Sang-Gyun Woo ; Joo-Tae Moon
Sponsor(s): Japan Soc. Appl. Phys.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Tokyo, Japan, Japan
Conference Date: 11 July 2000
Page Count: 2
Page(s): 96 - 97
ISBN (Paper): 4-89114-004-6
DOI: 10.1109/IMNC.2000.872640
Regular:

Flow process using a novel resist called the SMART (Samsung Advanced Resist for Thermal flow process) was studied. The SMART consisted of conventional polyhydroxy styrene-based polymers and the... View More

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