IEEE - Institute of Electrical and Electronics Engineers, Inc. - Formation of micro eaves analyzed by energy balance model at threefold of Cu film/DFR/Ni plating solution

Digest of Papers Microprocesses and Nanotechnology 2000. 2000 International Microprocesses and Nanotechnology Conference

Author(s): Yoshida, H. ; Nakamura, T. ; Kawakami, Y. ; Kawai, A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Tokyo, Japan, Japan
Conference Date: 11 July 2000
Page(s): 88 - 89
ISBN (Paper): 4-89114-004-6
DOI: 10.1109/IMNC.2000.872636
Regular:

DFR (Dry Film Photoresist) is widely used mainly in micro plating process. However as the result of liquid intrusion into substrate/DFR interface, a bird's-beak like "eaves" is formed at bottom of... View More

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