IEEE - Institute of Electrical and Electronics Engineers, Inc. - A multi-scale random-walk thermal-analysis methodology for complex IC-interconnect systems

2000 International Conference on Simulation of Semiconductor Processes and Devices

Author(s): Iverson, R.B. ; Le Coz, Y.L. ; Kleveland, B. ; Wong, S.S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Seattle, WA, USA, Washington
Conference Date: 6 September 2000
Page(s): 84 - 86
ISBN (Paper): 0-7803-6279-9
DOI: 10.1109/SISPAD.2000.871212
Regular:

We have developed and demonstrated a 3D multi-scale thermal-analysis methodology for multiple and stacked-chip configurations. This approach employs a global-local problem-domain discretization in... View More

Advertisement