IEEE - Institute of Electrical and Electronics Engineers, Inc. - Plasma damage evaluation of an integrated in-situ directional resist stripping process in magnetically enhanced RIE etcher for dual damascene application

2000 5th International Symposium on Plasma Process-Induced Damage

Author(s): Ma, S. ; Dahimene, M. ; Bjorkman, C. ; Shan, H. ; Ramanathan, R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Santa Clara, CA, USA, USA
Conference Date: 22 May 2000
Page(s): 113 - 116
ISBN (Paper): 0-9651577-4-1
DOI: 10.1109/PPID.2000.870631
Regular:

This paper demonstrates the plasma induced device damage performance of a directional resist removal process for Cu/low-k dielectric dual damascene interconnect integration application. A... View More

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