IEEE - Institute of Electrical and Electronics Engineers, Inc. - Evaluation of plasma induced damage of HDP FSG and USG in deep sub-micron technology

2000 5th International Symposium on Plasma Process-Induced Damage

Author(s): Ang Ting Cheong ; Loong Sang Yee ; Ong Puay Ing ; Tse Man Siu ; Sudijono, J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Santa Clara, CA, USA, USA
Conference Date: 22 May 2000
Page(s): 69 - 72
ISBN (Paper): 0-9651577-4-1
DOI: 10.1109/PPID.2000.870598
Regular:

We studied and compared the extent of plasma induced damage from high density plasma (HDP) undoped silicate glass (USG) and fluorinated silicate glass (FSG) deposition on 0.18 /spl mu/m... View More

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