IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal stress distribution in a high temperature heat pipe

Proceedings of 35th Intersociety Energy Conversion Engineering Conference

Author(s): Murdock, M. ; Human, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 24 July 2000
Volume: 2
ISBN (Paper): 1-56347-375-5
DOI: 10.1109/IECEC.2000.870878
Regular:

In this paper, the authors use temperature results from a heat pipe simulation code, to assess stress levels in the pipe's outer wall. Allowing curvature at one end gives normal and bending moment... View More

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