IEEE - Institute of Electrical and Electronics Engineers, Inc. - Incorporation of inorganic filler into the no-flow underfill material for flip-chip application

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces

Author(s): Lianhua Fan ; Songhua Shi ; Wong, C.P.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Braselton, GA, USA
Conference Date: 8 August 2000
Page(s): 303 - 310
ISBN (Paper): 0-930815-59-9
DOI: 10.1109/ISAPM.2000.869290
Regular:

The concept of no-flow underfill has drawn much interest for the past few years. The ideal simultaneous in-situ fluxing, interconnection of the solder joints and curing of the underfill material... View More

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