IEEE - Institute of Electrical and Electronics Engineers, Inc. - Flip chip self-alignment mechanism and modeling

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces

Author(s): Chen, R. ; Fennell, B. ; Baldwin, D.F.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Braselton, GA, USA
Conference Date: 8 August 2000
Page(s): 158 - 164
ISBN (Paper): 0-930815-59-9
DOI: 10.1109/ISAPM.2000.869261
Regular:

The self-alignment motion of the chip bond pads to the corresponding substrate bond pads is critical to the yield and reliability of next generation flip chip technology. Modeling the... View More

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