IEEE - Institute of Electrical and Electronics Engineers, Inc. - Formation of Ni3Sn4 at the boundary between Sn-Pb soldering layers and Au/Ni plated coatings

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces

Author(s): Maeda, A. ; Umemura, T. ; Qu, W. ; Tomita, Y. ; Abe, T.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Braselton, GA, USA
Conference Date: 8 August 2000
Page(s): 135 - 140
ISBN (Paper): 0-930815-59-9
DOI: 10.1109/ISAPM.2000.869257
Regular:

Ni3Sn4 formation should affect the reliability of soldering between package and printed circuit board. We have investigated the formation of the Ni3Sn4 at the boundary between Sn-Pb soldering... View More

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