IEEE - Institute of Electrical and Electronics Engineers, Inc. - Measurement of water evaporation rate for popcorning

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces

Author(s): Chong, J.I.-T. ; Lam, D.C.C. ; Tong, P.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Braselton, GA, USA
Conference Date: 8 August 2000
Page(s): 131 - 134
ISBN (Paper): 0-930815-59-9
DOI: 10.1109/ISAPM.2000.869256
Regular:

Popcorning during solder reflow is driven by evaporation of absorbed water into interfacial defect void. Due to lack of data, the steam pressure during popcorning has been assumed as a single... View More

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