IEEE - Institute of Electrical and Electronics Engineers, Inc. - Issues with fine pitch bumping and assembly

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces

Author(s): Nangalia, S. ; Deane, P. ; Bonfede, S. ; Huffman, A. ; Statler, C. ; Rinne, C.L.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Braselton, GA, USA
Conference Date: 8 August 2000
Page(s): 118 - 123
ISBN (Paper): 0-930815-59-9
DOI: 10.1109/ISAPM.2000.869254
Regular:

One of the primary areas of research at MCNC is fine pitch (100 /spl mu/m or smaller) solder bumping on existing I/O patterns and on redistributed connection footprints. The bumping process is... View More

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