IEEE - Institute of Electrical and Electronics Engineers, Inc. - Adhesion studies of polyimide-epoxy interfaces in flip chip assemblies

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces

Author(s): Pearson, R.A. ; Lloyd, T.B.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Braselton, GA, USA
Conference Date: 8 August 2000
Page(s): 58 - 62
ISBN (Paper): 0-930815-59-9
DOI: 10.1109/ISAPM.2000.869243
Regular:

The adhesive strength between underfill resins and organic passivation layers is controlled by the molecular interactions occurring at the interface and the plastic deformation mechanisms... View More

Advertisement