IEEE - Institute of Electrical and Electronics Engineers, Inc. - Copper-SiOC-AirGap integration in a double level metal interconnect

Proceedings of the IEEE 2000 International Interconnect Technology Conference

Author(s): Demolliens, O. ; Morand, Y. ; Fayolle, M. ; Cochet, M. ; Assous, M. ; Feldis, H. ; Lonis, D. ; Royer, J.C. ; Gobil, Y. ; Passemard, G. ; Maury, P. ; Jourdan, F. ; Cordeau, M. ; Morel, T. ; Perroud, L. ; Ulmer, L. ; Lugard, J.F. ; Renaud, D.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Burlingame, CA, USA
Conference Date: 7 June 2000
Page(s): 276 - 277
ISBN (Paper): 0-7803-6327-2
DOI: 10.1109/IITC.2000.854347
Regular:

This paper describes the integration of Copper with a SiOC/AirGap in a 0.18 /spl mu/m Double Level Metal Interconnect. A new concept is presented to achieve this ultimate interconnect scheme, and... View More

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