IEEE - Institute of Electrical and Electronics Engineers, Inc. - The investigation of galvanic corrosion in post-copper-CMP cleaning

Proceedings of the IEEE 2000 International Interconnect Technology Conference

Author(s): Chen, H.C. ; Yang, M.S. ; Wu, J.Y. ; Wang, V.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Burlingame, CA, USA
Conference Date: 7 June 2000
Page(s): 256 - 258
ISBN (Paper): 0-7803-6327-2
DOI: 10.1109/IITC.2000.854341
Regular:

The characteristics of galvanic corrosion in post-copper CMP cleaning are investigated. This type of corrosion occurs when CMP process completed, due to the heating lamp in SRD step. Particularly,... View More

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