IEEE - Institute of Electrical and Electronics Engineers, Inc. - Cleaning process strategies compatible with low-k dielectric and copper: state of the art, evolution and perspectives

Proceedings of the IEEE 2000 International Interconnect Technology Conference

Author(s): Louis, D. ; Beverina, A. ; Arvet, C. ; Lajoinie, E. ; Peyne, C. ; Holmes, D. ; Maloney, D. ; Lee, S. ; Lee, W.M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Burlingame, CA, USA
Conference Date: 7 June 2000
Page(s): 250 - 252
ISBN (Paper): 0-7803-6327-2
DOI: 10.1109/IITC.2000.854339
Regular:

This work presents an analysis of interconnect cleaning for low-k/copper integration. Analytical and electrical data are combined to understand the mechanisms and efficacy of various available... View More

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