IEEE - Institute of Electrical and Electronics Engineers, Inc. - Inline monitoring of multi-level dual inlaid copper interconnect technologies

Proceedings of the IEEE 2000 International Interconnect Technology Conference

Author(s): Kolagunta, V. ; Smith, B. ; Islam, R. ; Angyal, M. ; Mendonca, J. ; Bartaszewicz, S. ; Duraiswami, N. ; Jana, P. ; Veeraraghavan, S. ; Venkatesan, S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Burlingame, CA, USA
Conference Date: 7 June 2000
Page(s): 247 - 249
ISBN (Paper): 0-7803-6327-2
DOI: 10.1109/IITC.2000.854338
Regular:

A six level manufacturable copper interconnect technology using metal-first dual inlaid integration for a 0.2 /spl mu/m node is discussed. Various aspects of the technology can be monitored using... View More

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