IEEE - Institute of Electrical and Electronics Engineers, Inc. - Extension of copper plating to 0.13 /spl mu/m nodes by pulse-modulated plating

Proceedings of the IEEE 2000 International Interconnect Technology Conference

Author(s): Gandikota, S. ; Duboust, A. ; Siew Neo ; Liang-Yuh Chen ; Cheung, R. ; Carl, D.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Burlingame, CA, USA
Conference Date: 7 June 2000
Page(s): 239 - 241
ISBN (Paper): 0-7803-6327-2
DOI: 10.1109/IITC.2000.854336
Regular:

The electro-chemical deposition of copper can carried out by normal DC plating or using pulse plating approach. The superfill for gap fill can be achieved using either of these approaches-DC... View More

Advertisement