IEEE - Institute of Electrical and Electronics Engineers, Inc. - Integration of copper and fluorosilicate glass for 0.18 /spl mu/m interconnections

Proceedings of the IEEE 2000 International Interconnect Technology Conference

Author(s): Barth, E.P. ; Ivers, T.H. ; McLaughlin, P.S. ; McDonald, A. ; Levine, E.N. ; Greco, S.E. ; Fitzsimmons, J. ; Melville, I. ; Spooner, T. ; DeWan, C. ; Chen, X. ; Manger, D. ; Nye, H. ; McGahay, V. ; Biery, G.A. ; Goldblatt, R.D. ; Chen, T.C.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Burlingame, CA, USA
Conference Date: 7 June 2000
Page(s): 219 - 221
ISBN (Paper): 0-7803-6327-2
DOI: 10.1109/IITC.2000.854330
Regular:

The integration of dual damascene copper with fluorosilicate glass (FSC) at the 0.18 /spl mu/m technology node is described. The BEOL structure has been implemented for an advanced CMOS... View More

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