IEEE - Institute of Electrical and Electronics Engineers, Inc. - A copper drift-model for the low-/spl kappa/ polymer DVS-BCB

Proceedings of the IEEE 2000 International Interconnect Technology Conference

Author(s): Hoernig, T. ; Melzer, K. ; Schubert, U. ; Geisler, H. ; Barthar, J.W.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Burlingame, CA, USA
Conference Date: 7 June 2000
Page(s): 211 - 213
ISBN (Paper): 0-7803-6327-2
DOI: 10.1109/IITC.2000.854328
Regular:

To prove the reliability of DVS-BCB (Benzocyclobutene) as an interlevel-dielectric in copper-metallization-systems we investigated the extreme low copper drift rate in this... View More

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