IEEE - Institute of Electrical and Electronics Engineers, Inc. - The effect of residual tensile stress on electromigration lifetime of metal lines passivated by various oxides

Proceedings of the IEEE 2000 International Interconnect Technology Conference

Author(s): Young-Pil Kim ; Dong-Chul Kwon ; Han-Mei Choi ; Young-Wook Park ; Sang-In Lee
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Burlingame, CA, USA
Conference Date: 7 June 2000
Page(s): 205 - 207
ISBN (Paper): 0-7803-6327-2
DOI: 10.1109/IITC.2000.854326
Regular:

Residual stress of metal interconnects passivated by four different oxides was precisely measured by X-ray diffraction method, and the effect of this stress on electromigration (EM) lifetime of... View More

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