IEEE - Institute of Electrical and Electronics Engineers, Inc. - Electromigration in multi-level interconnects with polymeric low-k interlevel dielectrics

Proceedings of the IEEE 2000 International Interconnect Technology Conference

Author(s): Justison, P. ; Ogawa, E. ; Gall, M. ; Capasso, C. ; Jawarani, D. ; Wetzel, J. ; Kawasaki, H. ; Ho, P.S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Burlingame, CA, USA
Conference Date: 7 June 2000
Page(s): 202 - 204
ISBN (Paper): 0-7803-6327-2
DOI: 10.1109/IITC.2000.854325
Regular:

Electromigration (EM) characteristics were evaluated on multi-level Al(Cu) test structures with polymeric low k and standard oxide interlevel dielectrics. The two polymers used as interlevel... View More

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