IEEE - Institute of Electrical and Electronics Engineers, Inc. - Novel post electroplating in-situ rapid annealing process for advanced copper interconnect application

Proceedings of the IEEE 2000 International Interconnect Technology Conference

Author(s): Chen, M. ; Ho Seon Shin ; Cheung, R. ; Morad, R. ; Dordi, Y. ; Rengarajan, S. ; Tsai, S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Burlingame, CA, USA
Conference Date: 7 June 2000
Page(s): 194 - 196
ISBN (Paper): 0-7803-6327-2
DOI: 10.1109/IITC.2000.854323
Regular:

The room-temperature self-annealing behavior of electroplated (ECP) copper and its impact on device manufacturing has led to the investigation of a post ECP anneal process to stabilize copper film... View More

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