IEEE - Institute of Electrical and Electronics Engineers, Inc. - CVD copper thin film deposition by using (1-pentene)Cu(I)(hfac)

Proceedings of the IEEE 2000 International Interconnect Technology Conference

Author(s): Zhuang, W.W. ; Charneski, L.J. ; Evans, D.R. ; Sheng Teng Hsu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Burlingame, CA, USA
Conference Date: 7 June 2000
Page(s): 185 - 187
ISBN (Paper): 0-7803-6327-2
DOI: 10.1109/IITC.2000.854320
Regular:

Pure copper thin films have been deposited on both TiN and TaN substrates via CVD process by using a new volatile copper precursor, (1-pentene)Cu(I)(hfac). The effect of CVD process... View More

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