IEEE - Institute of Electrical and Electronics Engineers, Inc. - Picosecond ultrasonic study of the electrical and mechanical properties of CoSi/sub 2/ formed under Ti and TiN cap layers

Proceedings of the IEEE 2000 International Interconnect Technology Conference

Author(s): Stoner, R. ; Tas, G. ; Morath, C. ; Maris, H. ; Lee-Jen Chen ; Haw-Feng Chuang ; Chi-Tung Huang ; Yaw-Lin Hwang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Burlingame, CA, USA
Conference Date: 7 June 2000
Page(s): 179 - 181
ISBN (Paper): 0-7803-6327-2
DOI: 10.1109/IITC.2000.854318
Regular:

We report noncontact measurements of CoSi/sub 2/ layers made using a commercial picosecond ultrasonic system. The layers were formed in a two step RTP-process beginning with samples with nominally... View More

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