IEEE - Institute of Electrical and Electronics Engineers, Inc. - Tungsten via poisoning caused by water trapped in embedded organic low-K dielectrics

Proceedings of the IEEE 2000 International Interconnect Technology Conference

Author(s): Ikeda, K. ; Hasegawa, T. ; Tokunaga, K. ; Fukasawa, M. ; Kito, H. ; Miyamoto, T. ; Kadomura, S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Burlingame, CA, USA
Conference Date: 7 June 2000
Page(s): 158 - 160
ISBN (Paper): 0-7803-6327-2
DOI: 10.1109/IITC.2000.854311
Regular:

The control of hygroscopicity in dielectric films is one of the key technologies applied in the fabrication of multilevel interconnections. By experiment we identified a new water trap site... View More

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