IEEE - Institute of Electrical and Electronics Engineers, Inc. - Low-frequency noise measurement of copper damascene interconnects

Proceedings of the IEEE 2000 International Interconnect Technology Conference

Author(s): Koh, L.T. ; Chu, L.W. ; Pey, K.L. ; Chim, W.K.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Burlingame, CA, USA
Conference Date: 7 June 2000
Page(s): 152 - 154
ISBN (Paper): 0-7803-6327-2
DOI: 10.1109/IITC.2000.854309
Regular:

This paper presents results of using low-frequency noise measurement to characterize the quality and reliability of state-of-the-art copper damascene interconnects. Wafer-level low-frequency noise... View More

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