IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of W-plug via on electromigration lifetime of metal interconnect

Proceedings of the IEEE 2000 International Interconnect Technology Conference

Author(s): Guo, Q. ; Lo, K.F. ; Manna, I. ; Lim, S. ; Zeng, X. ; Cai, J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Burlingame, CA, USA
Conference Date: 7 June 2000
Page(s): 149 - 151
ISBN (Paper): 0-7803-6327-2
DOI: 10.1109/IITC.2000.854308
Regular:

The effect of W-plug via on electromigration (EM) lifetime of the metal interconnects with bamboo structure and single/multiple vias has been systematically investigated by using high resolution... View More

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