IEEE - Institute of Electrical and Electronics Engineers, Inc. - A thick-Cu process for add-on interconnections using photosensitive varnish for thick interlayer dielectric

Proceedings of the IEEE 2000 International Interconnect Technology Conference

Author(s): Saito, K. ; Kosugi, T. ; Yagi, S. ; Yamaguchi, C. ; Kudo, K. ; Yano, M. ; Kumazaki, T. ; Yaita, M. ; Ishii, H. ; Machida, K. ; Kyuragi, H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Burlingame, CA, USA
Conference Date: 7 June 2000
Page(s): 123 - 125
ISBN (Paper): 0-7803-6327-2
DOI: 10.1109/IITC.2000.854300
Regular:

A thick-Cu process suitable for the fabrication of add-on interconnections for microwave passive elements on ULSIs has been developed. The following three novel techniques were employed:... View More

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