IEEE - Institute of Electrical and Electronics Engineers, Inc. - Correlation of stress and texture evolution during self- and thermal annealing of electroplated Cu films

Proceedings of the IEEE 2000 International Interconnect Technology Conference

Author(s): Haebum Lee ; Lopatin, S.D. ; Wong, S.S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Burlingame, CA, USA
Conference Date: 7 June 2000
Page(s): 114 - 116
ISBN (Paper): 0-7803-6327-2
DOI: 10.1109/IITC.2000.854298
Regular:

Electroplated Cu films with different plating conditions and different thickness are characterized during self- and thermal annealing. Faster recrystallization and stress development at room... View More

Advertisement