IEEE - Institute of Electrical and Electronics Engineers, Inc. - Characterization and integration of porous extra low-k (XLK) dielectrics

Proceedings of the IEEE 2000 International Interconnect Technology Conference

Author(s): Changming Jin ; Wetzel, J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Burlingame, CA, USA
Conference Date: 7 June 2000
Page(s): 99 - 101
ISBN (Paper): 0-7803-6327-2
DOI: 10.1109/IITC.2000.854294
Regular:

Porous XLK dielectric films have been characterized and integrated into one level metal Cu damascene test structures. The material shows reduced dielectric constant as well as lower modulus... View More

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