IEEE - Institute of Electrical and Electronics Engineers, Inc. - Nanoscale elastic imaging: a new metrology tool for low-k dielectric integration

Proceedings of the IEEE 2000 International Interconnect Technology Conference

Author(s): Shekhawat, G.S. ; Kolosov, O.V. ; Briggs, G.A.D. ; Shaffer, E.O. ; Martin, S.J. ; Geer, R.E.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Burlingame, CA, USA
Conference Date: 7 June 2000
Page(s): 96 - 98
ISBN (Paper): 0-7803-6327-2
DOI: 10.1109/IITC.2000.854293
Regular:

A new characterization tool based on ultrasonic force microscopy (UFM) has been developed to image the nanoscale mechanical properties of metal/low-k polymer damascence test structures. Metal and... View More

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