IEEE - Institute of Electrical and Electronics Engineers, Inc. - New method to study unlanded via architecture. Application to advanced interconnects: Al with low k and copper dual damascene

Proceedings of the IEEE 2000 International Interconnect Technology Conference

Author(s): Gayet, P. ; Lair, C. ; van den Vegt, E.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Burlingame, CA, USA
Conference Date: 7 June 2000
Page(s): 73 - 75
ISBN (Paper): 0-7803-6327-2
DOI: 10.1109/IITC.2000.854286
Regular:

This paper describes a new test structure developed to study unlanded vias. The limitation of conventional chains to characterize vias is shown. The new structures enabled us to improve product... View More

Advertisement