IEEE - Institute of Electrical and Electronics Engineers, Inc. - Physical modeling of rinsing and cleaning of submicron trenches

Proceedings of the IEEE 2000 International Interconnect Technology Conference

Author(s): Hong Lin ; Busnaina, A.A. ; Suni, I.I.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Burlingame, CA, USA
Conference Date: 7 June 2000
Page(s): 49 - 51
ISBN (Paper): 0-7803-6327-2
DOI: 10.1109/IITC.2000.854278
Regular:

Cleaning of surfaces and submicron deep trenches is a tremendous challenge in semiconductor manufacturing. In this work, the rinsing of blanket and patterned wafers using pulsating flow are... View More

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