IEEE - Institute of Electrical and Electronics Engineers, Inc. - An evaluation of the HotOzone/sup TM/ process: a new post etch resist and residue removal process

Proceedings of the IEEE 2000 International Interconnect Technology Conference

Author(s): Shawming Ma ; Parker, R. ; Kavari, R. ; Leal, I. ; Boyers, D.G. ; Cremer, J.T., Jr.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Burlingame, CA, USA
Conference Date: 7 June 2000
Page(s): 46 - 48
ISBN (Paper): 0-7803-6327-2
DOI: 10.1109/IITC.2000.854277
Regular:

The HotOzone/sup TM/ process, a new ozone-water cleaning process for post-contact/via oxide etch or post-metal etch resist or residue removal, is evaluated. Test structures, using 0.35 /spl mu/m... View More

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