IEEE - Institute of Electrical and Electronics Engineers, Inc. - A grain size limitation inherent to electroplated copper films

Proceedings of the IEEE 2000 International Interconnect Technology Conference

Author(s): Brongersma, S.H. ; Richard, E. ; Vervoort, I. ; Maex, K.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Burlingame, CA, USA
Conference Date: 7 June 2000
Page(s): 31 - 33
ISBN (Paper): 0-7803-6327-2
DOI: 10.1109/IITC.2000.854272
Regular:

A study of changes in the Avrami exponent a during secondary grain growth in thin electroplated Copper layers shows an almost linear change between 1 and 3 as the thickness of the layer increases... View More

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