IEEE - Institute of Electrical and Electronics Engineers, Inc. - Multilevel test structures for metal CMP integration application to Cu/SiO/sub 2/ damascene interconnect

Proceedings of the IEEE 2000 International Interconnect Technology Conference

Author(s): Fayolle, M. ; Gayet, P. ; Morand, Y.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Burlingame, CA, USA
Conference Date: 7 June 2000
Page(s): 28 - 30
ISBN (Paper): 0-7803-6327-2
DOI: 10.1109/IITC.2000.854271
Regular:

This paper presents a method to evaluate the metal CMP impact on the performance of multilevel interconnect. For this purpose specific two metal level test structures have been defined, after a... View More

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